Joining Techniques in the Building Construction
21st International Symposium on bonding - Januar 13-14, 2003 - New Munich Trade Fair Center

In cooperation with the new Munich Trade Fair Centre the 21st international symposium on bonding technology "Joining Techniques in the Building Construction Industry" will take place for the first time in the course of the "Bau 2003".

The participants of this symposium will have the unique chance to get theoretically and practically oriented information on newest developments and trends in the building construction industry by visiting highly qualified papers and by contacting the numerous exhibitor companies (1831 exhibitors from 40 countries in 2001!).
This broad communication platform and the increased number of sessions in 2003 will contribute to use the advantages of the bonding and sealing technology on a larger scale than today in the building construction industry.

Moreover, we want to give you some ideas and help you in developing new processes and applications at our own fair stand in the foyer of the "Bau 2003". There everyone can have a look at future trends and new technologies in the building construction industry.

We invite and request suppliers and users of joining and sealing techniques in the building construction industry to form this symposium with us. The aim of this forum is not only to push the bonding and sealing technology but also the bonding and sealing in civil engineering as a whole to give new impulses for economic and fail-safe building.